電源: DC +12V ~ +24V
溫度: -20 ~ +65℃
重量: 125g " />
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        歡迎光臨 : 北京品立科技有限責任公司服務熱線 :+86-400-127-3302
        語言選擇: 中文版 ∷  英文版

        NVIDIA Jetson 開發(fā)系統(tǒng)

        • Y-C17-DEV開發(fā)系統(tǒng)
        • Y-C17-DEV開發(fā)系統(tǒng)
        • Y-C17-DEV開發(fā)系統(tǒng)
        Y-C17-DEV開發(fā)系統(tǒng)Y-C17-DEV開發(fā)系統(tǒng)Y-C17-DEV開發(fā)系統(tǒng)

        Y-C17-DEV開發(fā)系統(tǒng)

        載板尺寸:85mm * 63mm * 35mm
        電源: DC +12V ~ +24V
        溫度: -20 ~ +65℃
        重量: 125g

        Y-C17-DEV是基于NVIDIA Jetson Xavier? NX、NVIDIA Jetson ORIN? NX和NVIDIA Jetson ORIN? NANO模塊驅(qū)動的Plink AI自研開發(fā)系統(tǒng)。所有元器件均為寬溫型,具有多種外部接口。通過MiniPCIe連接器(包括USB 2.0和PCIe X1號)可承載數(shù)百個功能模塊,實現(xiàn)系統(tǒng)功能的進一步擴展。Y-C17載板M.2 B Key插槽可直接承載4G/5G通信模塊,載板自帶Nano SIM卡槽。


        2 x Type-C連接器
        1 x Nano型SIM卡連接器
        1 x 全長MiniPCIe連接器
        1 x M.2 2230 M key槽位
        1 x M.2 3050 B key槽位(可擴展4G/5G通信模塊)

        1x2 Lane MIPI相機接口FPC連接器
        1 x 3.3V RTC供電接口
        1 x風扇控制接口(5V)
        上電自動開機
        防脫落電源接線端子
        板卡尺寸:85mm * 63mm * 35mm
        電源輸入:DC +12V~+24V
        工作溫度:-25 ~ +65°C
        重量:125g

        NVIDIA Jetson Orin NX與NVIDIA Jetson Orin Nano模組參數(shù)


        Jetson Orin NX 16GB
        Jetson Orin NX 8GB

        Jetson Orin Nano 8GB

        Jetson Orin Nano 4GB

        Jetson Xavier NX 16GB

        Jetson Xavier NX 8GB
        AI Perf
        100 TOPS
        70 TOPS
        40 TOPS
        20 TOPS
        21 TOPS

        GPU

        1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
        1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
        512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores
        384-core NVIDIA Volta? architecture GPU with 48 Tensor Cores

        CPU

        8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
        2MB L2 + 4MB L3
        6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
        1.5MB L2 + 4MB L3
        6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
        1.5MB L2 + 4MB L3
        6-core NVIDIA Carmel Arm®v8.2 64-bit CPU
        6MB L2 + 4MB L3

        Memory

        16GB 128-bit LPDDR5
        102.4GB/s
        8GB 128-bit LPDDR5
        102.4GB/s
        8GB 128-bit LPDDR5
        68 GB/s
        4GB 64-bit LPDDR5
        34 GB/s
        16GB 128-bit LPDDR4x
        59.7GB/s
        8GB 128-bit LPDDR4x
        59.7GB/s

        Storage

        -
        (Supports external NVMe)
        16GB eMMC 5.1
        Video Encode
        1x 4K60 (H.265)
        3x 4K30 (H.265)
        6x 1080p60 (H.265)
        12x 1080p30 (H.265)
        1080p30 supported by 1-2 CPU cores
        2x 4K60 (H.265)
        4x 4K30 (H.265)
        10x 1080p60 (H.265)
        22x 1080p30 (H.265)

        Video Decode

        1x 8K30 (H.265)
        2x 4K60 (H.265)
        4x 4K30 (H.265)
        9x 1080p60 (H.265)
        18x 1080p30 (H.265)
        1x 4K60 (H.265)
        2x 4K30 (H.265)
        5x 1080p60 (H.265)
        11x 1080p30 (H.265)
        2x 8K30 (H.265)
        6x 4K60 (H.265)
        12x 4K30 (H.265)
        22x 1080p60 (H.265)
        44x 1080p30 (H.265)

        CSI Camera

        Up to 4 cameras (8 via virtual channels***)
        8 lanes MIPI CSI-2
        D-PHY 2.1 (up to 20Gbps)
        Up to 4 cameras (8 via virtual channels***)
        8 lanes MIPI CSI-2
        D-PHY 2.1 (up to 20Gbps)
        Up to 6 cameras
        (24 via virtual channels)
        14 lanes MIPI CSI-2
        D-PHY 1.2 (up to 30 Gbps)

        PCIe

        1 x4 + 3 x1
        (PCIe Gen4, Root Port, & Endpoint)
        1 x4 + 3 x1
        (PCIe Gen3, Root Port, & Endpoint)
        1 x4 (PCIe Gen4) + 1 x1 (PCIe Gen3)

        USB

        3x USB 3.2 Gen2 (10 Gbps)
        3x USB 2.0
        3x USB 3.2 Gen2 (10 Gbps)
        3x USB 2.0
        1x USB 3.2 Gen2 (10 Gbps)
        3x USB 2.0

        Power

        10W - 25W
        10W - 20W
        7W - 15W
        7W - 10W
        10W - 20W
        Mechanical 69.6mm x 45mm
        260-pin SO-DIMM connector

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