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Y-C17-DEV is based on the Plink AI development system driven by NVIDIA Jetson Xavier? NX、NVIDIA Jetson ORIN? NX and NVIDIA Jetson ORIN? NANO modules. All the components on the board are of wide temperature type, the main interface is designed for electrostatic safety protection, and the power supply application scheme of high reliability is adopted. The input power supply has the functions of overvoltage and reverse polarity protection, and has a variety of external interfaces. It can also carry hundreds of functional modules through a MiniPCIe connector (including USB2.0 and PCIe X1 signals) to achieve further expansion of system functions. The M.2 B key slot of the Y-C17 carrier board can directly carry 4G/5G communication modules, and the carrier board has a Nano SIM card slot.
2 x Type-Cconnector
1 x NanotypeSIM card connector
1 xfull lengthMiniPCIeconnector
1 x M.22230M keyslot
1 x M.2 3050 B keyslot（Expandable 4G/5G communication module）
1 x 2 Lane MIPI camera interface FPC connector
1 x 3.3V RTCpower supply port
1 xFan control interface（5V）
Automatic power on
Anti-shedding power supply terminals
Board size：85mm * 63mm * 35mm
Power input: DC +12V～+24V
Working temperature: -40 ~ +65℃
Weight: 125g
NVIDIA Jetson Orin NX/NVIDIA Jetson Orin Nano module
technical specification
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Jetson Orin NX 16GB |
Jetson Orin NX 8GB |
Jetson Orin Nano 8GB |
Jetson Orin Nano 4GB |
Jetson Xavier NX 16GB |
Jetson Xavier NX 8GB |
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AI Perf |
100 TOPS |
70 TOPS |
40 TOPS |
20 TOPS |
21 TOPS |
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GPU |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
384-core NVIDIA Volta? architecture GPU with 48 Tensor Cores |
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CPU |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core NVIDIA Carmel Arm®v8.2 64-bit CPU 6MB L2 + 4MB L3 |
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Memory |
16GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 68 GB/s |
4GB 64-bit LPDDR5 34 GB/s |
16GB 128-bit LPDDR4x 59.7GB/s |
8GB 128-bit LPDDR4x 59.7GB/s |
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Storage |
- (Supports external NVMe) |
16GB eMMC 5.1 |
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Video Encode |
1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) |
1080p30 supported by 1-2 CPU cores |
2x 4K60 (H.265) 4x 4K30 (H.265) 10x 1080p60 (H.265) 22x 1080p30 (H.265) |
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Video Decode |
1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) |
1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) |
2x 8K30 (H.265) 6x 4K60 (H.265) 12x 4K30 (H.265) 22x 1080p60 (H.265) 44x 1080p30 (H.265) |
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CSI Camera |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
Up to 6 cameras (24 via virtual channels) 14 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) |
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PCIe |
1 x4 + 3 x1 (PCIe Gen4, Root Port, & Endpoint) |
1 x4 + 3 x1 (PCIe Gen3, Root Port, & Endpoint) |
1 x4 (PCIe Gen4) + 1 x1 (PCIe Gen3) |
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USB |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
1x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
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Power |
10W - 25W |
10W - 20W |
7W - 15W |
7W - 10W |
10W - 20W |
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| Mechanical |
69.6mm x 45mm 260-pin SO-DIMM connector |
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